个人简介
邓吨英，女，博士，高级工程师。2014年在复旦大学获工学博士学位，先后在宝柏包装有限公司、湖南利德电子浆料公司，国防科技大学和长沙新材料产业研究院等单位工作。
主持湖南省重点研发计划1项，主持航天科工及湖南航天预言项目及重点研发项目2项。目前以第一作者在国际期刊上发表论文5篇，国际会议口头报告2次，获授权国家发明专利2项，PCT专利一项。
主要项目及获奖：
[1]入选2018年湖南省121创新人才工程第三层次人选；
[2]入选2018年长沙市第三批高层次人才D类；
[3]湖南省重点研发项目，2016-2017.
会议口头报告：
1.DunyingDeng,TiankeQi,YuanrongChen,YunxiaJin,FeiXiao.Preparationofantioxidativenanocopperpastesforprintedelectronicsapplication.2012InternationalConferenceonElectronicPackagingTechnology&HighDensityPackaging.Guilin,Oralreport,2012,8.
2.DunyingDeng,YunxiaJin,YuanrongChen,TiankeQi,FeiXiao.Preparationofcoppernanoparticalswithlowsinteringtemperature.The14thInternationalConferenceonElectronicsMaterialsandPackaging.Hongkong,Oralreport,2012,12.
授权发明专利列表：
1.邓吨英，肖斐。有机铜盐墨水和铜导电薄膜的制备方法，申请号：CN201210385310.0.
2.邓吨英，肖斐。纳米铜油墨和铜导电薄膜的制备方法，申请号：CN201210393141.5.
3.DunyingDeng，FeiXiao.Nano-copperinkandcopperconductivefilmpreparation.No.WO/2014/059798
研究领域
纳米银、纳米铜导电墨水、金/银电子浆料及纳米合金的制备及应用研究
开展印刷电子功能材料如纳米/微米金属导电墨水及电子浆料的研究工作
近期论文
1.DunyingDeng,ChongHuang,JinMa,ShuxinBai,Reducingresistanceandcuringtemperatureofsilverpastescontainingnanowires.JMaterSci:MaterElectron,2017,29,10834-10840.
2.DunyingDeng,MinhaoShi.Insitupreparationofsilvernanoparticlesdecoratedgrapheneconductiveinkforinkjetprinting.JMaterSci:MaterElectron,2017,28,15411-15417.
3.DunyingDeng,TiankeQi,YuanrongCheng,YunxiaJinandFeiXiao.Coppercarboxylatewithdifferentcarbonchainlengthsasmetal-organicdecompositionink.JMaterSci:MaterElectron,.2014,2514321-14328.
4.DunyingDeng,YunxiaJin,YuanrongCheng,TiankeQi,andFeiXiao.CopperNanoparticles:AqueousPhaseSynthesisandConductiveFilmsFabricationatLowSinteringTemperature.ACSAppl.Mater.Interfaces,2013,5,3839−3846.
5.DunyingDeng,YuanrongCheng,YunxiaJin,TiankeQi,andFeiXiao.Antioxidativeeffectoflacticacid-stabilizedcoppernanoparticlespreparedinaqueoussolution.J.Mater.Chem.,2012,22,23989–23995.
6.YunxiaJin,DunyingDeng,YuanrongCheng,LingqiangKong,FeiXiao.Annealing-free,long-termreliableandstronglyadhesivesilvernanowirenetworksbyintroductionofnonconductiveandbiocompatiblepolymerbinder.Nanoscale,DOI:10.1039/C3NR05820D.
7.WenjunChen,DunyingDeng,YuanrongCheng,FeiXiao.Highlyconductiveandreliablecopper-filledisotropicallyconductiveadhesivesusingorganicacidsforoxidationprevention.Journalofelectronicmaterials.2015,7(44).