Education Ph.D., California Institute of Technology, Chemical Engineering & Materials Science, 1992

Frank Shi is an IEEE Fellow (named in 2011) and a recipient of the Sustained Outstanding Technical Achievement Award from the IEEE-CPMT (Component Packaging and Manufacturing Technology) Society, 2010. His specific interdisciplinary research activities focus on (1) Packaging & Manufacturing Technologies for Optoelectronic Devices, (2) Materials for Optoelectronic Device Packaging & Manufacturing, and (3) IC Packaging and Manufacturing issues.

P.G. Chiu (primary), D.T. Hsu, H.K. Kim, F.G. Shi, H.S. Nalwa and B. Zhao, Low-k Materials for Microelectronics Interconnects, Chapter 6, in Handbook of Advanced Electronic and Photonic Materials, Academy Press, pp.203-234, 2000. Kumomi, H. and F. G. Shi, Fundamentals for the Formation and Structure Control of Thin Films: Nucleation, Growth & Solid-State Transformations, in Handbook of Thin Film Materials, Academic Press, pp. 319-374, 2001. Ju H. Choi, Alfred Margaryan, Ashot Margaryan, Frank G. Shi, CHAPTER-2: Analysis of the Laser Transition and Non-Radiative Properties of Nd3+ in Novel Fluorophosphate Glasses, in Physics and Chemistry of Rare-Earth Ions Doped Glasses, Edited by N. SOORAJ HUSSAIN & J.D DA SILVA SANTOS, Trans Tech Pub. Inc., Laubisrutistr, Switzerland, pp49-68, Yuan-Chang Lin, Yan Zhou, Nguyen T. Tran and Frank G. Shi, Chapter 18 LED and Optical Device Packaging and Materials, in Materials for Advanced Packaging Edited by Daniel Lu, C. P. Wong, Springer pp 629-680, 2009 (primary) Z. Tang, T. Shi and Frank G. Shi, Advanced Packaging of Optoelectronic Devices in Wiley Encyclopedia of Electrical and Electronics Engineering, pp 1-27, Published Online: 18 JAN 2013, DOI: 10.1002/047134608X.W8193 (primary) LED Die Bonding Materials by Yu-Chou Shih, Jiun-Pyng You and Frank G. Shi, in Materials for Advanced Packaging, pp 733-766, Springer, 2nd ed., 2016 (primary) Silicon Solar Cell Metallization by Yu-Chou Shih and Frank G. Shi, c in Materials for Advanced Packaging, pp 855-878, Springer, 2nd ed., 2016 (primary