PhD, Materials Science and Engineering, Massachusetts Institute of Technology Dissertation: "Nanomechanical studies of metallic glasses at ambient and elevated temperatures" Advisor: Prof. Christopher A. Schuh Program: Structural and Environmental Materials Minor: Mathematics BS, Materials Science and Engineering, Massachusetts Institute of Technology

Mechanical properties and behavior of materials, especially at micro- and nano-scales Stress-driven failure in renewable energy materials Nanomechanical testing at elevated temperatures Traditional and novel microfabrication methods

Packard, C.E., Franke, O., Homer, E.R., Schuh, C.A., "Nanoscale strength distribution in amorphous versus crystalline metals.", J. Mater. Res., 25, 12, 2010 Trenkle, J.C., Packard, C.E., Schuh, C.A., "Hot nanoindentation in inert environments.", Rev. Sci. Instrum., 81, 073901, 2010 Packard, C.E., Homer, E.R., Al-Aqeeli, N., Schuh, C.A., "Cyclic hardening of metallic glasses under Hertzian contacts: Experiments and STZ dynamics simulations.", Phil. Mag., 90: 10, 2010 Packard, C.E., Murarka, A., Lam, E.W., Schmidt, M.A., Bulovic, V., "Contact-printed microelectromechanical systems.", Adv. Mater. 22, 2010 Packard, C.E., Trenkle, J.C., Schuh, C.A., "Nanoindentation: High Temperature." In: K.H.J. Buschow, R.W. Cahn, M.C. Flemings, B. Ilschner (print), E.J. Kramer, S. Mahajan, and P. Veyssiere (updates), Editor(s)-in-Chief, Encyclopedia of Materials: Science and Technology, Elsevier, Oxford, 2010, Pages 1-6 Packard, C.E., Schroers, J., Schuh, C.A., "In situ measurements of surface tension-driven shape recovery in a metallic glass.", Scripta Mater. 60, 2009 Packard, C.E., Witmer L.M., Schuh, C.A., "Hardening of a metallic glass during cyclic loading in the elastic range.", Appl. Phys. Lett. 92, 171911, 2008 Packard, C.E., and Schuh, C.A., "Initiation of shear bands near a stress concentration in metallic glass.", Acta Mater. 55, 2007 Schuh, C.A, Packard, C.E., Lund, A.C., "Nanoindentation and contact-mode imaging at high temperatures.", J. Mater. Res. 21, 3, 2006