张广平 照片

张广平

博士生导师,中科院“百人计划”入选者

所属大学: 中国科学院金属研究所

所属学院: 沈阳先进材料研究发展中心

邮箱:
gpzhang@imr.ac.cn

研究领域

微/纳米尺度材料及其力学行为;层状材料及其力学性能;先进材料的疲劳与断裂行为。

近期论文

H.S. Liu, B. Zhang, G. P. Zhang, Enhanced toughness and fatigue properties of cold roll-bonded Cu/Cu laminated composites with mechanical contrast, Scripta Mater. 65 (2011) pp. 891-894.

M. Wang, B. Zhang, G.P. Zhang, C.S. Liu, Scaling of reliability of gold interconnect lines subjected to alternating current, Appl. Phys. Lett. 99 (2011) 011910.

Y. P. Li, G. P. Zhang, On plasticity and fracture of nanostructured Cu/X (X = Au, Cr) multilayers: The effects of length scale and interface/boundary. Acta Mater. 58 (2010) pp. 3877-3887.

X. F. Zhu, Y. P. Li, G. P. Zhang, J. Tan, Y. Liu, Understanding nanoscale damage at a crack tip of multilayered metallic composites. Appl. Phys. Lett. 92 (2008) pp.161905-1~161905-3.

Y. P. Li, G. P. Zhang, J. Tan and B. Wu, Direct observation of dislocation plasticity in 100 nm scale Au/Cu multilayers. Appl. Phys. Lett. 91 (2007) pp.061912-1-061912-3.