研究领域
无铅电子焊料；材料失效分析
近期论文
A.P. Xian *，M. Liu, Effect of humidity on tin whisker growth from Sn3Nd intermetallic compound, J. Mater. Res., 27[12], 1652-1662,(2012)
H.C. Shi; A.P. Xian*， Tin Whisker Growth on NdSn(3) Powder，JOURNAL OF ELECTRONIC MATERIALS， 40[9]，1962-1966，(2011)
M. Liu; A.P. Xian*，TEM observation of tin whisker，SCIENCE CHINA-TECHNOLOGICAL SCIENCES，54[6]， 1546-1550, （2011）
H.C. Shi; Xian Ai-Ping* ，Tin Whisker Growth on NdSn3 Powder，JOURNAL OF ELECTRONIC MATERIALS 40[ 9]，1962-1966 (2010)
M.Liu, A.P.Xian*, Tin Whisker growth on the surtace of Sn-0.7cu Lead-free solder With a Rare earth(Nd) addition，J.Electro, Mater. 38[11], 2353-2361 (2009)
M.Liu, A.P.Xian* ,Tin whisker growth on bulk Sn-Pb tutectic doping Nd，Microelectronics Reliability, 49, 667-672 (2009)
A.P.Xian*，M.Liu, Observation of continuos tin whisker growth in NdSn3 intermetallic compound，J.Mater.Res.,24[9], 2775-2783, (2009)
M. Liu, A.P. Xian*, Spontaneous growth of whiskers on RE-bearing intermetallic compounds of Sn-RE, In-RE, and Pb-RE，J. ALLOYS AND COMPOUNDS，486[1-2]， 590-596 （2009）
Xian AP, Gong GL, Surface oxidation of molten Sn-0.07 wt% P in air at 280 degrees C, JOURNAL OF MATERIALS RESEARCH, 23[ 6 ], (2008), 1532-1536
B.Jiang and A.P.Xian, Whisker growth on tin finishes of different electrolyes, Microelectronics Reliability, 48[1]， 105-110（2008）
Jiang B, Xian AP, Spontaneous growth of tin whiskers on tin-rare earth alloys, Phil. Mag. Lett., Vol.87, No7, 657-662, 2007
Jiang B, Xian AP，Observation of ribbon-like whiskers on tin finish surface, J. Mater Sci-Mater Electro 18 (5): (2007), 513 -518
Xian AP, Gong GL, Oxidation behavior of molten tin doped with phosphorus, JOURNAL OF ELECTRONIC MATERIALS, 36[12], (2007),1669-1678
Jiang B, Xian AP，Discontinuous growth of tin whiskers, Phil. Mag. Lett., Vol.86, No.8 : 521-527, 2006