工作经历 2021.8-至今 副教授 厦门大学 材料科学与工程 2015.9-2021.7 助理教授 厦门大学 材料科学与工程 2012.12-2015.9 博士后研究员 哈尔滨工业大学 电力电子与电力传动 教育背景 2009.07-2012.10 工学博士 哈尔滨工业大学 材料加工工程 2007.09-2009.07 工学硕士 哈尔滨工业大学 材料加工工程 2002.09-2006.07 工学学士 哈尔滨工业大学 材料成型及控制工程

电子封装材料与可靠性 纳米金属浆料制备与应用 先驱体陶瓷材料与器件

1.Yuxi Yu*, Yixin Liu, Zhihao Zhang*, Fabrication of high fracture-strength and gas-tightness PDC films via PIP process for pressure sensor application, Journal of the American Ceramic Society, 2020, https://doi.org/10.1111/jace.17063. 2.Z.H. Zhang*, C.W. Wei, J.J. Han*, H.J. Cao, H.T. Chen*, M.Y. Li, Growth evolution and formation mechanism of η′-Cu6Sn5 whiskers on η-Cu6Sn5 intermetallics during room-temperature ageing, Acta Materialia, 2020, 183, 340-349. 3.Zhihao Zhang*, Cunwei Wei, Huijun Cao*, Ye Zhang*, Damage mechanism of Cu6Sn5 intermetallics due to cyclic polymorphic transitions, Materials, 2019, 12, 4127. 4.Z.H. Zhang*, C.W. Wei, H.J. Cao*, J.J. Han, Y. Zhang, Structure-induced metastable phase transformation in Cu6Sn5 intermetallics, Materials Letters, 2019, 249, 124-127. 5.Chunjin Hang, Junjian He, Zhihao Zhang*, Hongtao Chen*, Mingyu Li, Low temperature bonding by infiltrating Sn3.5Ag solder into porous Ag sheet for high temperature die attachment in power device packaging, Scientific Reports, 2018, 8, 17422. 6.Y. Xiao*, Z.H. Zhang*, M. Yang, H.F. Yang, M.L. Li*, Y. Cao, The effect of NaOH on room-temperature sintering of Ag nanoparticles for high-performance flexible electronic application, Materials Letters, 2018, 222, 16-20. 7.Z.H. Zhang*, H.J. Cao. H.T. Chen, Formation mechanism of a cathodic serrated interface and voids under high current density, Materials Letters, 2018, 211, 191-194. 8.Zhihao Zhang*, Huijun Cao, Yong Xiao, Yong Cao, Mingyu Li, and Yuxi Yu. Electromigration-induced growth mode transition of anodic Cu6Sn5 grains in Cu/SnAg3.0Cu0.5/Cu lap-type interconnects. Journal of Alloys and Compounds, 2017, 703, 1-9. 9.Zhihao Zhang*, Huijun Cao, Haifeng Yang, Yong Xiao, Mingyu Li, Yuxi Yu, and Shun Yao. Microstructural Evolution and Migration Mechanism Study in a Eutectic Sn-37Pb Lap Joint Under High Current Density. Journal of Electronic Materials, 2017, 46, 5028-5038. 10.Z.H. Zhang*, M.Y. Li*, Z.Q. Liu and S.H. Yang. Growth characteristics and formation mechanisms of Cu6Sn5 phase at the liquid-Sn0.7Cu/(111)Cu and liquid-Sn0.7Cu/(001)Cu joint interfaces. Acta Materialia, 2016, 104, 1-8. 11.Zhihao Zhang*, Huijun Cao, Mingyu Li*, Yuxi Yu, Haifeng Yang and Shihua Yang. Three-dimensional placement rules of Cu6Sn5 textures formed on the (111)Cu and (001)Cu surfaces using electron backscattered diffraction. Materials & Design, 2016, 94, 280-285. 12.Z.H. Zhang*, H.J. Cao, H.F. Yang, M.Y. Li* and Y.X. Yu. Hexagonal-Rod Growth Mechanism and Kinetics of the Primary Cu6Sn5 Phase in Liquid Sn-Based Solder. Journal of Electronic Materials, 2016, 45, 5985-5995. 13.M.Y. Li*, H.F. Yang, Z.H. Zhang*, J.H. Gu and S.H. Yang. Fast formation and growth of high-density Sn whiskers in Mg/Sn-based solder/Mg joints by ultrasonic-assisted soldering: Phenomena, mechanism and prevention. Scientific Reports, 2016, 6, 27522. 14.Mingyu Li*, Yong Xiao, Zhihao Zhang* and Jie Yu. Bimodal Sintered Silver Nanoparticle Paste with Ultrahigh Thermal Conductivity and Shear Strength for High Temperature Thermal Interface Material Applications. ACS Applied Materials & Interfaces, 2015, 7, 9157-9168. 15.Z.H. Zhang, H.J. Cao, M.Y. Li*, Y. Wang and Z.Q. Liu*. Cathodic peeling damage of Cu6Sn5 phase in Cu/SnAg3.0Cu0.5/Cu bridge interconnections under current stressing. Journal of Applied Physics, 2014, 116, 054909. 16.Zhihao Zhang, Mingyu Li* and Chunqing Wang*. Fabrication of Cu6Sn5 single-crystal layer for under-bump metallization in flip-chip packaging. Intermetallics, 2013, 42, 52-55. 17.M.Y. Li*, Z.H. Zhang and J.M. Kim*. Polymorphic transformation mechanism of η and η' in single crystalline Cu6Sn5. Applied Physics Letters, 2011, 98, 201901.