研究领域
化学镀铜和电化学镀铜技术 (1)无甲醛化学镀铜溶液的研究； (2) 超级化学镀铜体系和超级电镀铜体系的基础研究及应用； (3) 环境友好的表面微蚀技术研究。
近期论文
Zhifeng Yang, Na Li, Xu Wang, Zhixiang Wang, and Zenglin Wang, Bottom-Up Filling in Electroless Plating with an Addition of PEG–PPG Triblock Copolymers, Electrochem. Solid-State Lett., 2010, 13(7), D947-49 .
Zhixin Li, Na Li, Lie Yin, Yue He, and Zenglin Wang, An environment-friendly surface pretreatment of ABS resin prior to electroless plating, Electrochem. Solid-State Lett., 2009, 12(12), D92-95
Zenglin Wang, Zonghuai Liu, Zupei Yang, Shoso Shingubara. Characterization of sputtered tungsten nitride film and its application to Cu electroless plating. Microelectron. Eng. 2008, 85, 395-400
Zenglin Wang, Zhijuan Liu, Hongyan Jiang, Xiu Wei Wang. Bottom-up fill mechanisms of electroless copper plating with addition of mercapto alkyl carboxylic acid. J. Vac. Sci. Technol. B, 2006, 24(2), 803-806
Zenglin Wang, Shoso Shingubara, Hiroyuki Sakaue, Takayuki Takahagi. Bottom-up copper fill with addition of mercapto alkyl carboxylic acid in electroless plating. Electrochimi. Acta. 2006, 51, 2442-2446
Zenglin Wang, Shoso Shingubara, Hiroyuki Sakaue, Takayuki Takahagi. Characterization of electroless-plated Cu film over Pd catalytic layer formed by an ionized cluster beam. J. Electrochem. Soc. 2005,152 (10), C682-C687
Zenglin Wang, Osamu Yaegashi, Hiroyuki Sakaue, Takayuki Takahagi and Shoso Shingubara. Bottom-up fill for submicrometer copper via holes of ULSIs by electroless plating. J. Electrochem. Soc. 2004, 151(12), C781-C785
Zenglin Wang, Osamu Yaegashi, Hiroyuki Sakaue, Takayuki Takahagi and Shoso Shingubara. Effect of additives on hole fill property in electroless copper plating. Jpn. J. Appl. Phys. 2004, 43(10), 7000-7001
Zenglin Wang, Osamu Yaegashi, Hiroyuki Sakaue, Shoso Shingubara and Takayuki Takahagi. Suppression of native oxide growth in sputtered TaN films and its application for Cu electroless plating. J. Appl. Phys. 2003, 97(7), 4697-4701
Zenglin Wang, Osamu Yaegashi, Hiroyuki Sakaue, Takayuki Takahagi and Shoso Shingubara. Highly adhesive electroless Cu layer formation by ultra thin ICB-Pd catalytic layer for sub 100 nm Cu interconnections. Jpn. J. Appl. Phys. Express Lett. 2003, 42(10B), L1223-L1225
Zenglin. Wang, T. Ida, H. Sawa, H. Sakaue, S. Shingubara and T. Takahagi. Electroless plating of copper on metal-nitride diffusion barriers initiated by displacement plating. Electrochem. Solid-State Lett. 2003, 6(3), C38-C41