杨亮
副教授 博士
所属大学: 厦门理工学院
所属学院: 材料科学与工程学院
个人简介
杨亮,男,1986年06月出生,工学博士,硕博连读毕业于华中科技大学,副教授,硕士生导师。
长期从事半导体光电器件封装测试、封装工艺开发及失效分析、各种功能材料的制备开发和应用、材料成分和器件失效分析等领域的科研和教学工作,近年来主要以半导体光电器件封装(LED封装)和新材料(光电复合材料)为具体技术方案。先后主持国家自然科学基金1项、福建省自然科学基金1项、厦门市青年创新科技计划项目1项、校级科研课题2项;以第一发明人身份公开发明专利2项(已授权1项),实用新型专利1项(授权);在《Optics Letters》、《Applied Optics》、《IEEE Transactions on Components, Packaging and Manufacturing Technology》、《光学学报》等知名期刊上发表学术论文10余篇,其中EI收录7余篇。
近年来承担的主要科研项目: 1.国家自然科学基金,基于Sn-P-F-O基质的低熔点BSSO、SCASN荧光粉掺杂复合材料的制备、测试和封装机理研究/61904156,研究经费:26万元,起止时间:2019.01-2021.12,主持 2.福建省自然科学基金面上项目,基于微流体控制技术的荧光粉保形涂覆原理及工艺研究/2016J01322,研究经费:6万元,起止时间:2016.06-2019.06,主持 3.福建省教育厅A类项目/JAT160351,荧光粉保形涂覆原理及工艺实现,研究经费:1万元,起止时间:2016.07-2019.07,主持 4.厦门理工高层次人才项目,大功率LED用荧光陶瓷的制备、表征和封装测试/E2014117,研究经费:5万元,起止时间:2014.06-2017.06,主持 5.厦门理工科技攀登计划项目,LED封装及灯具一体化集成制造/XPDKQ18009,研究经费:2万元,起止时间:2018.07-2020.07,主持
研究领域
半导体光电器件及材料
1.半导体光电器件封装测试
2.封装设计及工艺开发
3.功能材料开发应用
4.材料成分和器件失效分析
近期论文
1. Liang Yang*, Qin Zhang, Feng Li, An Xie, Long Mao, Jidong Ma. Thermally stable lead-free phosphor in glass enhancement performance of light emitting diodes applicationl. Applied Optics, 2019.58(15): 4009-4014.
2. Liang Yang*, An Xie, Dan Xie, Xiayun Shu. A New Method of Robust Phosphor Glass Fabrication and Performances for LEDs.IEEE Proc. of ICEPT-HDP, 2015, 1258-1262.
3. Liang Yang, Mingxiang Chen, Zhicheng Lv, Simin Wang, Xiaogang Liu, Sheng Liu. Preparation of a YAG: Ce phosphor glass by screen-printing technology and its application in LED. Optics Letters, 2013, 38(13): 2240-2243.
4. Liang Yang, Simin Wang, Zhicheng Lv, Sheng Liu. Color deviation controlling of phosphor conformal coating by advanced spray painting technology for white LEDs. Applied Optics, 2013, 52(10): 2075-2079.
5. Liang Yang, Zhicheng Lv, Yuan Jiaojiao, Sheng Liu. Effects of MF resin and CaCO3 diffuser loaded encapsulation on CCT uniformity of the phosphor converted LEDs. Applied Optics, 2013, 52(22):5539-5544.
6. Liang Yang, Mingxiang Chen, Sheng Liu. Fabrication of Gel Glass Containing High Rendering Phosphor Mixture via Sol-Gel Process for LEDs. IEEE Proc. of ECTC, 2013, 2371-2374.
7. Liang Yang, Zhicheng Lv, Mingxiang Chen, Sheng Liu. Combination of Translucent Eu:YAG Glass Ceramic with LED chip. IEEE Proc. of ECTC, 2012, 2145-2149.
8. Liang Yang, Mingxiang Chen, Shan Yu, Zhicheng Lv, Sheng Liu. Fabrication of YAG Glass Ceramic and Its Application for Light Emitting Diodes. IEEE Proc. of ICEPT-HDP, 2012,1463-1466.
9. Liang Yang, Mingxiang Chen, Shengjun Zhou, Sheng Liu. Preparation of Phosphor Glass via Screen Printing Technology and Packaged Performance for LEDs. IEEE Proc. of ICEPT-HDP, 2013, 1189- 1192.
10. Zhicheng Lv, Liang Yang, Jiaojiao Yuan, Jing Fang, Bin Cao, Sheng Liu, Study on Packaging Method Using Silicon Substrate with Cavity and TSV for Light Emitting Diodes. IEEE Transactions on Components, Packaging and Manufacturing Technology. 2013, 3(7):1123-1129.
11. Yu Shan, Yang Liang, Cao Bin, Zheng Huai, Cheng Mingxiang, Liu Sheng. Development Process of Phosphor Coating with Screen Printing for White Light Emitting Diode Packaging. IEEE Proc. of ICEPT-HDP, 2011, 1-5.
12. Zhicheng Lv, Jiaojiao Yuan, Jing Fang, Liang Yang, Xuefang Wang, Sheng Liu, Carrierless thin wafer handling for 3D integration, 13th International Conference on Electronic Packaging Technology & High Density Packaging, 2012, 922-925.
13. 张文静,张芹,杨亮等,基于Spiro-OMeTAD电子阻挡层的量子点发光二极管电荷平衡改善,《光学学报》, 2019,39(5), 296-304.