陈奕屹
职称未知
所属大学: 北京理工大学
所属学院: 前沿交叉科学研究院
个人主页:
https://arims.bit.edu.cn/xztd/jsml/sjldyjs/06cbcca593874e6da376d70489a9a5f0.htm
个人简介
教育和工作经历 本科 2011-2015,诺丁汉大学大学建筑环境与工程专业 博士 2015-2020,诺丁汉大学大学,流体与热能专业 高级研发工程师 2019-2021,Dynex Semiconductor,研发岗位
研究领域
沸腾传热 功率模块热管理 飞机防除冰
近期论文
Chen, Y. , Li, B. , Wang, X. , Wang, X. , & Li, H. . (2020). Direct phase-change cooling of vapor chamber integrated with igbt power electronic module for automotive application. IEEE Transactions on Power Electronics, PP(99), 1-1. Li, B. , Y Chen, Wang, X. , Y Li, & Y Yan. (2020). Heat spreading performance of sic-based power module with bonded vapour chamber for electric powertrain integration. Applied Thermal Engineering. Chen, Y. , Li, B. , Wang, X. , Yan, Y. , Wang, Y. , & Qi, F. . (2019). Investigation of heat transfer and thermal stresses of novel thermal management system integrated with vapour chamber for igbt power module. Thermal Science & Engineering Progress. Chen, Y. , Yan, Y. , & Li, B. . (2020). Thermal analyses of power electronics integrated with vapour chamber cooling. Automotive Innovation. Chen, Y. , Li, B. , Yan, Y. , & Wang, Y. . (2018). MODELING AND EXPERIMENTAL ANALYSIS OF HEAT TRANSFER FOR POWER ELECTRONIC MODULE INTEGRATED WITH PHASE CHANGE THERMAL MANAGEMENT SYSTEM. International Heat Transfer Conference 16. Chen,Y., Y Yan., Li,B., Gong, W. .(2017). Thermal Characterization Analysis of IGBT Power Module Integrated with a Vapour Chamber and Pin-Fin Heat Sink. PCIM Europe 2017; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nuremberg, Germany, pp. 1-8.