田栋 照片

田栋

讲师

所属大学: 济南大学

所属学院: 化学化工学院

邮箱:
chm_tiand@ujn.edu.cn

研究领域

表面处理(电镀、化学镀)、化学电源

表面处理(电镀、化学镀)、化学电源

近期论文

Replacement Deposition of Ni-S Films on Cu and Their Catalytic Activity for Electroless Nickel Plating[J]. Journal of the Electrochemical Society, 2013, 160(3): D95-D101. (IF=2.859) A Pd-free Activation Method for Electroless Nickel Deposition on Copper[J]. Surface and Coatings Technology, 2013, 228: 27-33. (IF=2.199) Study of Underlying Premonolayer Oxidation of Nickel Electrode in Basic Solution Related to the Catalytic Oxidation of Hypophosphite on Nickel[J]. ECS Electrochemistry Letters, 2012, 1(2): H5-H7. (IF=1.54)