史铁林（Shi Tielin，Professor），1964年1月出生，中共党员，博士，教授，博士生导师，国家级领军人才，曾任机械学院党委书记。1985年本科、1988年硕士毕业于西安交通大学，1991年博士毕业于华中理工大学，1993年博士后出站，进入华中科技大学（原华中理工大学）工作。现任中国振动工程学会常务理事，中国振动工程学会动态信号分析专业委员会主任委员，中国振动工程学会故障诊断专业委员会副主任委员，中国微米纳米技术学会理事，《Frontiers of Mechanical Engineering》副主编、《机械工程学报》、《振动工程学报》、《中国机械工程》、《中国工程机械学报》、《振动与冲击》、《振动测试与诊断》等杂志编委。先后获国家教委科技进步二等奖（应用类），国家教委科技进步一等奖（理论类），机械工业部科技进步一等奖，国家科技进步三等奖，中国青年科技奖，全国优秀博士后、湖北省五四青年奖章、中国机械工程学会杰出青年科技奖、首批“新世纪百千万人才工程”国家级人选等荣誉称号等。主持完成或承担科研项目40多项，包括国家863项目、国家自然科学基金重大研究计划培育项目、国家自然科学基金面上项目、总装预研项目等。发表学术论文250余篇，其中SCI论文100篇，申请国家发明专利80多项，授权50多项。

微系统与微制造 MEMS测试、封装及可靠性 精密仪器与装备 状态监测与故障诊断 信号分析

现任中国振动工程学会常务理事，中国振动工程学会动态信号分析专业委员会主任委员，中国振动工程学会故障诊断专业委员会副主任委员，中国微米纳米技术学会理事，《Frontiers of Mechanical Engineering》副主编、《机械工程学报》、《振动工程学报》、《中国机械工程》、《中国工程机械学报》、《振动与冲击》、《振动测试与诊断》等杂志编委

[1] Wei Zhu, Tielin Shi (史铁林*), Zirong Tang, Bo Gong, Guanglan Liao, John Tully, Dynamic selective etching: a facile route to parabolic optical fiber nano-probe, Optics Express (IF 3.54), 21(6), pp. 6919–6927, 2013 [2] Shuang Xi, Tielin Shi (史铁林*), Dan Liu, Liangliang Xu, Hu Long, Wuxing Lai, Zirong Tang,Integration of carbon nanotubes to three-dimensional C-MEMS for glucose sensors,Sensors and Actuators A: Physical (IF 1.84),198 (2013) 15-20 [3] Shuang Xi, Tielin Shi (史铁林*), Lei Zhang, Dan Liu, Wuxing Lai, Zirong Tang, Highly visible-light reflective SiOxNy nanowires for bright-white reflector applications, Thin Solid Films (IF 1.60), 529, pp115–118, 2013 [4] Li Jiang, Tielin Shi (史铁林*), Jianping Xuan. Fault diagnosis of rolling bearings based on Marginal Fisher analysis. Journal of Vibration and Control (IF 1.96). DOI: 10.1177/1077546312463747 [5] Biao Chen, Tielin Shi (史铁林*), Mo Li, Zhaobo Zhang, Zhijing Zhu and Guanglan Liao. Laser Welding of Zr41Ti14Cu12Ni10Be23 Bulk Metallic Glass: Experiment and Temperature Field Simulation. Advanced Engineering Materials (IF 1.61), 2013, 15, No. 5: 407-413 [6] Q. Xia, T. L. Shi (史铁林*), S. Y. Liu, M. Y. Wang. Shape and topology optimization for tailoring stress in a local region to enhance performance of piezoresistive sensors, Computers and Structures (IF 1.51), 2013, 114–115:98–105. [7] Q. Xia, T. L. Shi (史铁林*), M. Y. Wang. A method for shape and topology optimization of truss-like structure, Structural and Multidisciplinary Optimization (IF 1.73), 2013, 47:687-697. [8] K. Wang, T.L. Shi (史铁林*), G.L. Liao, Q. Xia，Image registration using a point-line duality based line matching method, Journal of Visual Communication and Image Representation (IF 1.19), 2013, 24:615–626. SCI, [9] Bo Sun, Tielin Shi (史铁林*), Wenjun Sheng, and Guanglan Liao. Controlled Fabrication of Silicon Nanowires via Nanosphere Lithograph and Metal Assisted Chemical Etching. Journal of Nanoscience and Nanotechnology (IF 1.15), Vol. 13, 5708–5714, 2013 [10]Q. Xia, M. Y. Wang, T. L. Shi (史铁林*). A move limit strategy for level set based structural optimization, Engineering Optimization (IF 0.96), http://dx.doi.org/10.1080/0305215X.2012.720681. [11]WENJUN SHENG, TIELIN SHI (史铁林*), ZHENGCHUN PENGa, BO SUN, GUANGLAN LIAO. Fabrication of antireflective silicon nanowires array. Journal of Optoelectronics And Advanced Materials (IF 0.52) Vol. 15, No.3 - 4, March – April 2013, p. 133 - 138 [12]Liu Dan, Shi Tielin (史铁林*), Xi Shuang, Lai Wuxing, Liu Shiyuan, Li Xiaoping, Tang Zirong，Concentration gradient induced morphology evolution of silica nanostructure growth on photoresist-derived carbon micropatterns, Nanoscale Research Letters (IF 2.52), 7, pp1-9, 2012 [13]Xiangning Lu, Tielin Shi (史铁林*), Qi Xia, Guanglan Liao. Thermal conduction analysis and characterization of solder bumps in flip chip package, Applied Thermal Engineering (IF 2.13) 36 (2012) 181-187 [14]Lei Zhang, Tielin Shi (史铁林*), Zirong Tang, Dan Liu, Shuang Xi，Stress-driven and Carbon-assisted Growth of SiOxNy Nanowires on Photoresist-derived Carbon Microelectrode, IEEE Journal of Microelectromechanical Systems (IF 2.09), 21(6), pp1445-1451, 2012. [15]Xi Shuang, Shi Tielin (史铁林*), Xu Liangliang, Tang Zirong, Liu Dan, Li Xiaoping, Liu Shiyuan，Metal-Catalyst-Free Synthesis and Characterization of Single-Crystalline Silicon Oxynitride Nanowires，Journal of Nanomaterials (IF 1.54), 2012, pp1-8, 2012. [16]Junchao Liu, Tielin Shi (史铁林*), Ke Wang, Zirong Tang, Guanglan Liao. Defect detection of flip-chip solder joints using modal analysis, Microelectronics Reliability (IF 1.14) 52 (2012) 3002–3010 [17]JIANG Xuan, SHI TieLin (史铁林*), ZUO HaiBo, YANG XueFeng, WU WenJun & LIAO GuangLan. Investigation on color variation of Morpho butterfly wings hierarchical structure based on PCA. SCIENCE CHINA Technological Sciences (IF 1.18), 2012, Vol.55 No.1: 16–21 [18]Junchao Liu, Tielin Shi (史铁林*), Qi Xia, Guanglan Liao. Flip chip solder bump inspection using vibration analysis. Microsyst Technol (IF 0.83) (2012) 18:303–309 [19]Dan Liu, Tielin Shi (史铁林*), Zirong Tang, Lei Zhang, Shuang Xi, Xiaoping Li, Wuxing Lai. Carbonization-assisted integration of silica nanowires to photoresist-derived three-dimensional carbon microelectrode arrays. Nanotechnology (IF 3.84) 22: 465601-465608 (2011) [20]Shuang Xi, Tielin Shi (史铁林*), Lei Zhang, Dan Liu, Wuxing Lai, Zirong Tang. Growth of highly bright-white silica nanowires as diffusive reflection coating in LED lighting. Optical Express (IF 3.54), 19: 26507-26514 (2011) [21]Wei Ma, Tielin Shi (史铁林*), Zirong, Tang, Shiyuan Liu, Rizwan Malik, Lei Zhang. High-throughput dielectrophoretic manipulation of bioparticles within fluids through biocompatible three-dimensional microelectrode array. Electrophoresis (IF 3.26) 32: 494-505 (2011) [22]Lei Zhang, Tielin Shi (史铁林*), Zirong Tang, Dan Liu, Shuang Xi, Xiaoping Li, Wuxing Lai. Carbon-assisted growth and high visible-light optical reflectivity of amorphous silicon oxynitride nanowires. Nanoscale Research Letters (IF 2.52) 6: 469-474 (2011) [23]Q. Xia, T. L. Shi (史铁林*), M. Y. Wang, S. Y. Liu. Simultaneous optimization of cast part and parting direction using level set method, Structural and Multidisciplinary Optimization (IF 1.73), 2011, 44:751–759. [24]Yang Gao, Qi Xia, Guanglan Liao, Tielin Shi (史铁林*). Sensitivity Analysis of a Bioinspired Refractive Index Based Gas Sensor. Journal of Bionic Engineering (IF 1.14) 8 (2011) 323–334 [25]Rizwan Malik, Tielin Shi (史铁林*), Zirong Tang, Shiyuan Liu, Effect of ultra violet process and annealing on reliability in low temperature silicon wafer direct bonding, Advanced Science Letters (IF 1.253), 2011,4(3):774-780. [26]Peng, P; Liao, GL; Shi, TL (史铁林*); Tang, ZR; Gao, Y. Molecular dynamic simulations of nanoindentation in aluminum thin film on silicon substrate; Applied Surface Science (IF 2.11). 2010, 256(21) 6284-6290 [27]Dong Wang, Teilin Shi (史铁林*), Jie Pan, Guanglan Liao, Zirong Tang, Lin Liu. Finite element simulation and experimental investigation of forming micro-gear with Zr–Cu–Ni–Al bulk metallic glass Journal of Materials Processing Technology (IF 1.95) 210 (2010) 684–688 [28]Guanglan Liao, Tielin Shi (史铁林*), Xiaohui Lin, Ziwen Ma. Effect of surface characteristic on room-temperature silicon direct bonding. Sensors and Actuators A (IF 1.84) 158 (2010) 335–341 [29]Lei Zhang, Tielin Shi (史铁林*), Shuang Xi, Dan Liu, Zirong Tang, Xiaoping Li, Wuxing Lai. Carbon nanotube integrated 3-dimensional carbon microelectrode array by modified SU-8 photoresist photolithography and pyrolysis. Thin Solid Films (IF 1.60) 520: 1041-1047 (2010) [30]Ping Peng, Tielin Shi (史铁林*), Guanglan Liao, Zirong Tang. Combined AFM nano-machining and RIE to fabricate high aspect ratio structures, Journal of Nanoscience and Nanotechnology (IF 1.15) 10: 7287-7290 (2010) [31]Zengbing Xu, Jianping Xuan, Tielin Shi (史铁林*), Bo Wu, Youmin Hu. Application of a modified fuzzy ARTMAP with feature-weight learning for the fault diagnosis of bearing. Expert Systems with Applications (IF 1.85). 36(2009) 9961–9968 [32]Zengbing Xu, Jianping Xuan, Tielin Shi (史铁林*), Bo Wu, Youmin Hu. A novel fault diagnosis method of bearing based on improved fuzzy ARTMAP and modified distance discriminant technique; Expert Systems with Applications (IF 1.85) 36 (2009) 11801–11807 [33]Xiaohui Lin, Guanglan Liao, Zirong Tang, Tielin Shi (史铁林*). UV surface exposure for low temperature hydrophilic silicon direct bonding; Microsyst Technol (IF 0.83) (2009) 15:317–321