一直从事集成电路可靠性方向，在国际顶级期刊/会议如Science、Nature子刊、IEEE EDL、IEEE TED、VLSI、IEDM等发表论文261篇，引用达到10770次(截至2024年7月)。获得授权专利76项。 学术成果 · 聚焦集成电路材料与微纳器件的可靠性研究。 · 研究平面晶体管高k栅介质层失效机理，通过原位技术直接观察氧空位缺陷诱导的导电通路形成过程，修正了可靠性模型，实现了器件寿命的精准预测。相关结果发表在IEEE TED、EDL等期刊。 · 研究鳍式晶体管FinFET击穿和自热耦合效应机理，通过原位定位导致失效的缺陷，明确了击穿诱导金属电迁移的机理，通过优化设计抑制电迁移，延长了器件寿命。相关工作发表在VLSI、IRPS等会议。 · 研究二维材料基传感器，通过原位观察缺陷在外场作用下的演化过程，揭示了影响二维材料基传感器的可靠性机理。相关结果发表在Nature子刊、Adv. Mater.等期刊

智能传感技术

中国电子学会青工委担任副秘书长 中国国际半导体技术大会担任技术委员会委员 全国大学生集成电路创新创业大赛担任专家委员 IEEE国际集成电路物理与失效分析会议执行委员 Infomat（IF=25）、半导体学报编委

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